Worlds first 300mm IBD System for MRAM Manufacturing Cell

 With the advent of magnetoresistive random-access memory (MRAM), a type of random-access memory believed to eventually surpass competing technologies, there was demand for apparatus and a system to manufacture devices on a scale for cost effective production of devices. 

This need was identified by SPTS (then AVIZA Technology) to design and manufacture such a system, (Ion Beam Deposition),  capable of processing a 300mm Wafer through the layers of the MRAM stack without breaking vacuum.

• Thermal management and an IBD Chamber made from a single piece of material, sourcing vacuum compatible billet of such a size
• Finding manufacturing machining capability to machine from solid complex 5 axis geometry to high vacuum standards sourced locally
• Under floor facilitisation and site preparation, material excavation and removal with no dust contamination in an ISO Class 7 cleanroom
• Material movement, handling, transition and presentation for assembly heavy components where no gantry equipment existed

The manufacturing engineer was a part of the team of a multi-skilled design engineer's comprising of mechanical, electrical, physics and nano technology expertise to design and manufacture the worlds first 300mm IBD System.  A Department of Trade and Industry part funded project of duration 18months to :

• Challenging material sourcing across Europe, Vendor selection and relations through to raw material selection, and machined component delivery to plan.  
• Evaluation and sourcing of material handling apparatus to cater for a step change in the scale  of component parts required, included dedicated transit fixturing, industrial manipulators, jig and fixture design and manufacture.
• Process Planning, cell design, facilitisation and manufacturing instructions for the complete module.
• Project management, and planning, across an 18month program including multiple stakeholders, delivery to strict timeline and budget, independently assessed by DTi.

Aviza Technology, a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, was credited with the introduction of StratIon(TM) fxP, the world's first 300-mm ready Ion Beam Deposition system.

The first system was shipped to CEA-LETI-MINATEC in Grenoble, France, one of Europe's foremost applied research centre's in electronics and Spontrpnics. The StratIon fxP was used to develop next-generation magnetic tunnel junction (MTJ)-based devices for applications including MRAM, hard disk drive read heads or RF components. The system was also used for the deposition of metal gates for advanced CMOS processes. In addition to the system shipment, Aviza and CEA-LETI  signed a three year joint development program covering the development of MTJ deposition processes for future MRAM and Spintronics devices.

If you have an operation with similar demand and need expert guidance though a similar project activity, contact the manufacturing engineer to arrange an intial conversation and start the ball rolling.