300mm Wafer Assembly Solutions for MRAM Manufacturing

With the advent of magnetoresistive random-access memory (MRAM), a type of random-access memory expected to eventually surpass competing technologies, there arose a demand for advanced manufacturing solutions to efficiently produce devices at scale. This need was identified by SPTS (then AVIZA Technology), which designed and manufactured an Ion Beam Deposition system capable of processing a 300mm wafer through the layers of the MRAM wafer assembly without breaking vacuum.

Thermal management and an IBD Chamber crafted from a single piece of material underscore the importance of advanced manufacturing solutions, particularly when sourcing vacuum compatible billet of such a size. Finding local manufacturing machining capabilities to create solid, complex 5-axis geometry that meets high vacuum standards is crucial for processes like Ion Beam Deposition. Additionally, under floor facilitisation and site preparation involve material excavation and removal with zero dust contamination in an ISO Class 7 cleanroom, which is essential for MRAM wafer assembly. Effective material movement, handling, transition, and presentation for heavy component assembly are implemented where no gantry equipment was previously available.

The manufacturing engineer was an integral member of a multi-skilled design engineering team, which included experts in mechanical, electrical, physics, and nanotechnology, tasked with designing and manufacturing the world's first 300mm Ion Beam Deposition (IBD) System. This project, partially funded by the Department of Trade and Industry, spanned 18 months and focused on advanced manufacturing solutions. The project involved challenging material sourcing across Europe, vendor selection and relationship management, as well as careful raw material selection and timely delivery of machined components. Furthermore, the evaluation and sourcing of material handling apparatus facilitated a significant scale-up in the component parts required, encompassing dedicated transit fixturing, industrial manipulators, and the design and manufacture of jigs and fixtures. Additionally, we developed comprehensive process planning, cell design, and manufacturing instructions for the complete module, including the critical MRAM wafer assembly. Project management and planning were meticulously carried out throughout the 18-month program, which included multiple stakeholders and adherence to a strict timeline and budget, independently assessed by the DTI.

Aviza Technology, a supplier of advanced manufacturing solutions and advanced semiconductor capital equipment for the global semiconductor industry and related markets, was credited with the introduction of StratIon(TM) fxP, the world's first 300-mm ready Ion Beam Deposition system. The first system was shipped to CEA-LETI-MINATEC in Grenoble, France, one of Europe's foremost applied research centers in electronics and Spintronics. The StratIon fxP was utilized to develop next-generation magnetic tunnel junction (MTJ)-based devices for applications such as MRAM, hard disk drive read heads, and RF components. Additionally, the system was employed for the deposition of metal gates in advanced CMOS processes. Alongside the system shipment, Aviza and CEA-LETI signed a three-year joint development program focused on advancing MTJ deposition processes for future MRAM wafer assembly and Spintronics devices.

If you have an operation with similar demand and require expert guidance on advanced manufacturing solutions, particularly in areas like Ion Beam Deposition or MRAM wafer assembly, contact the manufacturing engineer to arrange an initial conversation and start the ball rolling.